Published
Nickel Troubleshooting Guide
To complement the Nickel Plating Primer article in this month’s issue, the web exclusive is a troubleshooting guide for nickel plating. The guide, provided by Plating Process Systems, provides a generic listing of some symptoms encountered with most nickel-plating processes and possible corrective actions…
Plating Process Systems
BRIGHT NICKEL
Index Type | ||
Troubleshooting Bright Nickel Solutions with Bright Nickel Make-Up (Index Type) |
||
Symptom | Usual Causes | Correction |
Cloudy deposits (MCD and HCD areas) | ||
1. Low Brightener | 1. Increase concentration of Brightener | |
2. Low pH | 2. Adjust pH | |
3. Organic contamination | 3. Carbon treatment* | |
4. Metallic contamination (e.g., Fe, Si, Al, Cr+3) |
4. High pH + carbon treatment* | |
Cloudy deposits (LCD areas) | ||
1. Low Brightener | 1. Adjust Brightener concentration | |
2. Low pH | 2. Adjust pH | |
3. Low Bright Nickel Make-Up | 3. Add Bright Nickel make-Up | |
Dull deposits (LCD area) | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Metallic contamination (e.g., Cu, Zn, Pb, Cd) | 2. "Dummy" solution at 4-5 ASF* | |
3. Low Carrier | 3. Add Carrier | |
4. High agitation | 4. Reduce agitation rate | |
Poor leveling | ||
1. Low Brightener | 1. Add Brightener | |
2. Low Carrier | 2. Add Carrier | |
3. Low pH | 3. Adjust pH | |
4. Low Bright Nickel Make-Up | 4. Add Bright Nickel Make-Up | |
5. Low agitation | 5. Increase agitation rate | |
Poor ductility | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Low Carrier | 2. Add Carrier | |
3. High pH | 3. Adjust pH | |
4. Metallic contamination (e.g., Zn, Cd) | 4. "Dummy" solution at 4-5 ASF* | |
5. Organic contamination | 5. Carbon treatment* | |
Burning | ||
1. Low nickel salts/boric acid | 1. Add nickel salts/boric acid | |
2. High CD | 2. Reduce CD | |
3. Low temperature | 3. Adjust temperature | |
4. Low agitation | 4. Increase agitation rate | |
5. Chromate contamination | 5. High CD "dummy" + high pH treatment* | |
6. Metallic contamination (e.g., Fe, Al, Si) |
6. High pH + carbon treatment* | |
Skip plating | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Metallic contamination (e.g., Zn, Cd, Pb) | 2. "Dummy" solution at 4-5 ASF* | |
3. Chromate contamination | 3. High CD "dummy" + high pH treatment* | |
Poor chromium acceptance | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Low Carrier | 2. Add Carrier | |
3. Inadequate rinsing between Ni and Cr | 3. Improve rinsing | |
4. Cr solution out of balance | 4. Adjust Cr solution | |
High Consumption Carrier | ||
1. High drag-out | 1. Use reclaim tank | |
2. Excessive carbon usage | 2. Reduce amount of carbon used | |
3. Very high nickel concentration | 3. Dilute solution | |
Brightener | ||
1. High concentration of Brightener | 1. Reduce concentration of Brightener | |
2. Low anode area/polarized anodes | 2. Increase anode area and/or increase nickel chloride and/or reduce pH | |
Bright Nickel Make-Up | ||
1. High drag-out | 1. Use reclaim tank | |
2. Low anode area/polarized anodes | 2. Increase anode area and/or increase nickel chloride and/or reduce pH |
Non-Index Type | ||
Troubleshooting Bright Nickel Solutions Without Bright Nickel Make-Up (Non-Index Type) |
||
Symptom | Usual Causes | Correction |
Cloudy deposits (MCD and HCD areas) | ||
1. Low Brightener | 1. Increase Brightener concentration | |
2. Low pH | 2. Adjust pH | |
3. Organic contamination | 3. Carbon treatment* | |
4. Metallic contamination (e.g., Fe, Si, Al, Cr+3) |
4. High pH + carbon treatment* | |
Cloudy deposits (LCD areas) | ||
1. Low Brightener | 1. Adjust Brightener concentration | |
2. Low pH | 2. Adjust pH | |
Dull (dark) deposits (LCD area) | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Metallic contamination (e.g., Cu, Zn, Pb, Cd) | 2. "Dummy" solution at 4-5 ASF* | |
3. Low Carrier | 3. Add Carrier | |
4. High agitation | 4. Reduce agitation rate | |
Poor leveling | ||
1. Low Brightener | 1. Add Brightener | |
2. Low Carrier | 2. Add Carrier | |
3. Low pH | 3. Adjust pH | |
4. Low Leveling Agent | 4. Add Leveler | |
5. Low agitation | 5. Increase agitation rate | |
Poor ductility | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Low Carrier | 2. Add Carrier | |
3. High pH | 3. Adjust pH | |
4. Metallic contamination (e.g., Zn, Cd) | 4. "Dummy" solution at 4-5 ASF* | |
5. Organic contamination | 5. Carbon treatment* | |
Burning | ||
1. Low nickel salts/boric acid | 1. Add nickel salts/boric acid | |
2. High CD | 2. Reduce CD | |
3. Low temperature | 3. Adjust temperature | |
4. Low agitation | 4. Increase agitation rate | |
5. Chromate contamination | 5. High CD "dummy" + high pH treatment* | |
6. Metallic contamination (e.g., Fe, Al, Si) |
6. High pH + carbon treatment* | |
Skip plating | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Chromate contamination | 2. High CD "dummy" + high pH treatment* | |
3. Metallic contamination (e.g. Fe, Al, Si) | 3. High pH + carbon treatment* | |
Poor chromium acceptance | ||
1. High Brightener | 1. "Dummy" solution at 4-5 ASF* | |
2. Low Carrier | 2. Add Carrier | |
3. Inadequate rinsing between Ni and Cr solutions | 3. Improve rinsing | |
4. Cr solution out of balance | 4. Adjust Cr solution | |
High Consumption Carrier | ||
1. High drag-out | 1. Use reclaim tank | |
2. Excessive carbon usage | 2. Reduce carbon used | |
3. Very high nickel concentration | 3. Dilute solution | |
Brightener | ||
1. High concentration of Brightener | 1. Reduce concentration of Brightener | |
2. Low anode area/polarized anodes | 2. Increase anode area and/or increase nickel chloride and/or reduce pH | |
3. High agitation | 3. Reduce agitation rate. |
SEMI-BRIGHT NICKEL
Semi-Bright Nickel Troubleshooting | ||
Troubleshooting Semibright Nickel | ||
Symptom | Usual Cause | Correction |
Cloudy deposits (MCD and HCD areas) | ||
1. Low leveler | 1. Increase concentration of Leveler | |
2. Low pH | 2. Adjust pH | |
3. High Make Up additive | 3. Reduce Make Up concentration (carbon filter) |
|
4. High STEP Additive | 4. Discontinue additions temporarily | |
5. Organic contamination | 5. Carbon treatment | |
6. Metallic contamination (e.g., Fe, Si, Al, Cr+3) |
6. High pH + carbon treatment | |
7. Low agitation | 7. Increase agitation | |
Cloudy deposits (LCD areas) | ||
1. Low Leveler | 1. Adjust Leveler concentration | |
2. Low pH | 2. Adjust pH | |
Dull deposits (LCD area) | ||
1. Metallic contamination (e.g., Cu, Zn, Pb, Cd) | 1. "Dummy" solution at 4-5 ASF* | |
Too Bright | ||
1. High leveler | 1. Reduce Leveler concentration | |
2. Low Make Up | 2. Add Make Up | |
Poor leveling | ||
1. Low Leveler | 1. Add Leveler | |
2. Low Make Up | 2. Add Make Up | |
3. Low pH | 3. Adjust pH | |
4. High STEP Additive | 4. Discontinue additions temporarily | |
5. Low agitation | 5. Adjust agitation | |
Poor ductility | ||
1. High Leveler | 1. Reduce Leveler concentration | |
2. Low Make Up | 2. Add Make Up | |
3. High pH | 3. Adjust pH | |
4. Metallic contamination (e.g., Zn, Pb, Cd) | 4. "Dummy" solution at 4-5 ASF | |
5. Organic contamination | 5. Carbon treatment | |
Burning | ||
1. Low nickel salts/boric acid | 1. Add nickel salts/boric acid | |
2. High current density (CD) | 2. Reduce current density | |
3. Low temperature | 3. Adjust temperature | |
4. Low agitation | 4. Increase agitation | |
5. Chromate contamination | 5. High CD "dummy" + high pH treatment* | |
Skip plating | ||
1. High Leveler | 1. "Dummy" solution at 4-5 ASF | |
2. Low Make Up | 2. Add Make Up | |
3. Metallic contamination (e.g., Pb, Zn, Cd, Cr+6) | 3. "Dummy" solution at 4-5 ASF | |
High Consumption of: Make Up | ||
1. High drag-out | 1. Use reclaim tank | |
2. Excessive carbon usage on filter | 2. Reduce amount of carbon used | |
Leveler | ||
1. High concentration of Leveler | 1. Reduce concentration of Leveler | |
2. Low anode area (polarized anodes) | 2. Increase anode area | |
3. Organic contamination | 3. Carbon treatment (may help) |
DUPLEX NICKEL
Duplex Nickel Troubleshooting | ||
Troubleshooting Duplex Nickel | ||
Symptom | Usual Cause | Correction |
Poor STEP results | ||
1. Low STEP Additive in semibright nickel | 1. Add STEP Additive to semibright nickel | |
2. Poor Bright Nickel deposit | 2. Carbon treatment (may help) | |
3. Contamination of semibright nickel solution with sulfur containing material | 3. Adjust brightener in Bright Nickel solution | |
Poor corrosion performance | ||
1. See Poor STEP results above. | ||
2. Pits present in either Semibright Nickel or Bright Nickel solutions. | 2. Correct pitting problem (add anti-pitter and/or carbon treat solution) | |
3. Particulate matter present (indicated by rough deposits) in either Semibright or Bright nickel solutions. | 3. Filter solutions. | |
4. Microporous porous chromium layer not functioning (if used) | 4. Inspect microporous Nickel and/or chromium and correct. | |
Peeling of Bright Nickel layer from Semibright Nickel layer Overall | ||
1. Drying of Semibright Nickel solution during part transfer. | 1. If consistent, insert rinse operation between Semibright and Bright Nickel solutions. | |
2. Pickup of films during exit from Semibright Nickel or entrance to Bright Nickel solutions. | 2. See above and/or carbon treat each solution. | |
Trailing edges only | ||
Parts are bipolar exiting from Bright Nickel solution | Install live current exit from Bright Nickel (Use approx. 10% of normal rack current) | |
Leading edges only | ||
Parts are bipolar entering Semibright Nickel solution. | Install live current entrance to Semibright Nickel (Use approx. 10% of normal rack current) | |
Bottom of part/rack only | ||
Too much current during exit from Semibright Nickel and/or entry to Bright Nickel solutions. | Reduce current density at these points (consider removal of some anode material at these points) | |
Pattern after Bright Nickel | ||
1. Drying of Semibright Nickel solution during part transfer. | 1. If consistent, insert rinse operation between Semibright and Bright Nickel solutions. | |
2. Drying of foam from Semibright Nickel solution | 2. Carbon treat solution to reduce foaming or reduce air agitation to minimize foam. |
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