Patch/Fill Material

Question: I need a patch/fill material for stamped steel electronic enclosure cases.


Question:

I need a patch/fill material for stamped steel electronic enclosure cases. The final thickness covers a countersunk pin head in an area that is silk screened. This customer was using Bondo covered by liquid paint. The conversion to powder coating necessitates a filler material that will withstand the curing heat and will not outgas. What material should we use? J.G.

Answer:

There are two materials that fit the bill – Lab-metal by Alvin Products and Dura-bond by a company in California. I’m sorry, but I don’t remember the company’s name that makes Dura-bond.