Despite the simplicity
of their formula- tions, chromium plating baths are more complicated to operate
than most plating baths, and they require rigorous controls.
Chromic-Acid-Based
Baths
In plating
from hexavalent chromium baths, sulfate and fluoride ions act as catalysts. Temperature,
current density and bath composition affect the film characteristics and current
efficiency. These parameters are therefore carefully controlled in order to obtain
specific deposit properties and plating rates.
Thicknesses of deposits
vary from 0.25-0.5 micron, or more for hard chromium plating.
Bath Composition.
Chromic acid and sulfate are the necessary ingredients. Chromic-to-sulfate ratios
range from 75:1 to 250:1. The composition depends primarily on whether the bath
is co-catalyzed, for example, with fluorides, fluosilicates or fluoborates, and
on the application (decorative or hard chromium).
Cr+6 is the source of chromium
deposited from these baths. Chromic acid, Cr03, is the main component in solution
makeup. Cr+6 is reduced to Cr+3, which in turn is reduced to unstable Cr+2 and
further to Cr0.
Some Cr+3 is normally found
in operating baths, and indeed in the absence of Cr+3, little or no deposit is
obtained. The introduction of small amounts of reducing agents to a new solution
helps in bath startup.
An amount of Cr+3 exceeding
2-3% of the chromic acid content, however, reduces cathode efficiency and causes
a variety of plating problems.
The presence of other oxides
of metals, such as iron, copper and nickel, combined with Cr+3 hurts bath performance.
While the simple chromic-sulfate
baths produce about 12% efficiency, co-catalyzed baths may deposit at efficiencies
up to 22%. For a given composition, there is an optimum range of current density
and temperature that produces a bright deposit. When a specific composition is
found to produce the most desirable results for a given application, it should
then be tightly maintained by periodic analytical and control methods.
 |
| Plumbing
fixtures and fittings have been attractively finished using a trivalent chromium
plating solution.
|
Typical single-catalyst
and co-catalyst plating baths have the parameters shown in Table I.
In single-catalyst baths,
cathode efficiency increases proportionally with chromic acid concentration, up
to 250 g/liter, and decreases thereafter (see Figure 1). Solutions with higher
concentrations of chromic acid tolerate a higher level of trivalent chromium and
iron oxide contaminants. Additions of a secondary catalyst improve cathode efficiency
at high concentrations of chromic acid, up to 300 g/liter.
Analyses of chromic acid
(Cr+6), sulfate, secondary co-catalyst, for example, fluoride as well as trivalent
chromium (Cr+3) are needed to maintain the bath composition within the required
limits.
Temperature. Temperature
is closely related to current density in its effect on brightness and coverage
of deposit. Generally, the higher the current density, the higher the temperature
requirement (see Figure 2). An optimum temperature range exists for a given concentration
of chromic acid. Below or above that range, dull deposits result.
In general, for decorative
baths, the range is 35-46C. For hard chromium, the range is 49-65.5C.
Since the chromic acid
solutions used are fairly concentrated and viscous, stratification may occur.
This results in uneven temperature distribution within the solution. Agitation
is therefore required to equalize the bath temperature, produce uniform brightness
and, in the case of hard chromium, improve deposit hardness.
Preheating of parts to
optimum bath temperature may be needed before they are introduced to the plating
tank, and, in rare instances, cooling of parts may be required to ensure uniformity
of deposit. Using both heating and cooling coils in the same tank may be necessary
to maintain a precise temperature.
 |
| Chromium
platings from trivalent solutions now have acolor closer to that of chromium from
hexavalent chromium solutions. (Photo courtesy Atotech USA, Rock Hill, SC).
|
Current Density.
At given solution composition and temperature, current density affects cathode
efficiency, brightness and hardness. Generally, the optimum current density is
recommended by the manufacturer of the plating chemicals used. At too high a current
density, burning or roughness of deposit occur. At too low a current density,
lack of chromium coverage can be expected.
Be sure to use the proper
current source. Deposit hazing and/or peeling can be traced to electrical problems,
especially in conventional chromic-sulfate (single- catalyst) baths.
Three-phase rectifiers
with a maximum of 5% AC ripple should supply an uninterrupted flow of current
throughout the plating cycle. Standard current densities are in the range of 7.75-15.5
amp/dm2 for decorative plating and 23.25-100 amp/dm2 for hard chromium plating.
Anodes. Insoluble
lead or lead-antimony alloys are used. Plating of inside diameters and recessed
areas may require that conforming anodes be fixtured at close proximity (0.5-1
inch) to the surface to be plated.
In hard chromium plating,
the closer the anode-to-cathode distance, the better the deposit distribution.
Lead anodes ideally should be 90% as long as the cathodes. Tops and bottoms should
be slightly below and above the tops and bottoms of the cathodes (parts) to prevent
excessive build-up at the plated ends.
 |
| 1.
Effect of chromic acid concentration on current efficiency.
|
Properly operating lead
anodes form a layer of dark brown lead oxide. A yellow or light colored coating
on the anodes indicates a build-up of lead chromate, which results from too little
or no current flow, such as during idle periods. This light colored layer has
poor electrical conductivity.
Cleaning and reactivating
lead anodes can be performed chemically, using cleaners specially formulated for
that purpose. Once cleaned, the anodes should be properly rinsed and promptly
returned to the tank. A satisfactory distribution of anodes consists of three
anodes 2 inches in diameter or four 1.5-inch-diameter anodes per foot of anode
bar.
Self-Regulating High-Speed
Baths. This type of solution incorporates fluoride complexes such as silicofluorides
in addition to sulfates. Salts of low solubility are selected and used to release
the desired anions on a controlled basis. Mixtures containing potassium or sodium
silicofluoride and dichromate, for example, regulate the release of fluorides
by common-ion effect. Mixtures of strontium sulfate and chromate regulate the
release of sulfate. Consequently, at higher temperatures, the cathode current
efficiency increases as a result of the increased solubility of catalysts in this
type of bath.
Crack-Free Chromium.
This is deposited from baths with low catalyst ratio and high concentration of
chromic acid. Since the deposit is hard and brittle, it cracks when subjected
to strain, forming a macro-cracked layer.
Micro-Cracked Chromium.
Microcracking is produced by proprietary dual-catalyst baths. The micro-discontinuity
of the chromium layer results in spreading the corrosion potential that exists
between chromium and an underlying nickel plate. This reduces the anodic current
flowing to any one location on the nickel, greatly retarding the rate of corrosion.
Crack densities of 27-50 cracks per millimeter are specified for optimum corrosion
resistance.
 |
| 2.
At constant temperature, cathode efficiency increases with current density.
|
Microporous Chromium.
Microporous chromium also improves the corrosion resistance of nickel-chromium
deposits in a manner similar to that just described for microcracked chromium.
Regular hexavalent chromium deposits are typically made microporous by one of
two different methods.
The bright nickel layer
can be topped with another thin layer of nickel plated from a bath containing
a very fine suspension of inert particles, which codeposit with the nickel. Chromium
plated over this layer deposits around these particles, creating a microporous
structure.
Another way to produce
microporous chromium is to lightly spray the surface of the chromium deposit with
a hard, fine abrasive material such as 60- or 80-mesh alumina or sand. The brittle
chromium deposit breaks at the point of impact, forming micropores and exposing
the bright nickel layer beneath the chromium.
For best corrosion resistance,
the pore density in both cases must exceed 10,000 pores per square centimeter.
Cleaning and Surface
Preparation. Inadequate cleaning of the basis metal will lead to poor plating
results. In decorative plating, hazy, pitted or non-adherent nickel deposits will
be obtained as a result of inadequate surface preparation. The thin chromium deposit
will magnify and reflect these defects.
Allowing a nickel plated
surface to dry during transfer will passivate the nickel and produce milky, hazy
or no deposit when chromium plated. In hard chromium plating, surfaces of the
basis metal should be free of oil, grease or rust.
Etching of steel and stainless
steel ensures proper adhesion. The extent of etch needed depends on the composition
of the steel. Carbon steel should be etched for 15-30 sec and up to 45 sec if
the steel has been heat treated. Etching is best performed in non-catalyzed solutions
of 210-225 g/liter chromic acid to prevent overetching by sulfate and particularly
by fluoride catalysts.
Reverse etching in the
same plating bath usually introduces an excessive amount of iron into the bath
and should be avoided.
TRIVALENT
CHROMIUM PLATING
Toxicity,
low current efficiency, poor metal distribution, burns in high-current-density
areas, “white-wash” and lack of coverage around holes are some of
the problems associated with Cr+6 plating baths. These factors led to the eventual
development of a safer and more efficient system based on trivalent chromium.
 |
| 3.
Membrane separating anode box from cathode compartment in trivalent chromium plating
|
Trivalent chromium plating
baths for decorative applications enjoyed a steady, although initially slow, acceptance
as a substitute for hexavalent chromium plating. Their main attraction lies in
the fact that they eliminate many of the shortcomings of hexavalent chromium solutions.
Bath Chemistry.
Several advances in technology have taken place, making the process more readily
acceptable to platers.
There are currently at
least three basic types of trivalent chromium baths available. A single electrolyte
bath, chloride or sulfate based, using graphite or composite anodes and special
additives to prevent oxidation of trivalent chrome at the anodes (see “Single-Cell
Trivalent Chrome” sidebar).
Another type, a sulfate-based
system, uses shielded anodes. Conventional lead anodes are surrounded by boxes
sealed on one side by a selective ion membrane (see Figures 3 and 4) and filled
with dilute sulfuric acid.
The membrane used is a
perfluorinated sulfonic acid, reinforced with an inert Teflon® fabric. The
membrane prevents the migrating trivalent chromium ions in the solution from reaching
the anode, preventing their oxidation to the hexavalent state.
The mechanism provides
for excellent pH stability during plating. The bath is capable of producing light-colored
deposits very close to the appearance of deposits from hexavalent baths.
Table II summarizes the
differences between Cr+6 and Cr+3 plating bath parameters.
 |
| 4.
Trivalent chromium can be plated from a cell with shielded anode (left) or from
a single cell.
|
The sulfate type trivalent
chromium solution is maintained as one would maintain a conventional bright nickel
bath. It utilizes a primary additive containing the trivalent chromium ion and
a secondary additive that contains grain refiners and brighteners. These materials
are added on an amp-hr basis, using chemcial-feed pumps actuated by an amp-hr
meter.
Metallic impurities affect
results as shown in Table III. These impurities can be plated out on dummies as
can be done with nickel baths or through an external purification cell on a continuous
basis. Ion exchange columns can also be used as well as precipitating agents followed
by filtration.
A new insoluble catalytic
anode has been developed for use in direct contact with the electrolyte of the
sulfate-based system. The new anode is designed to maintain an electrode potential
level that will prevent oxidation of trivalent chrome at its surface. No selective
oxidation additives are used in the electrolyte. Consequently, the same high tolerance
to metallic impurities, light colored deposits and pH stability of this sulfate-based
process are maintained. The users have a choice in selecting the shielded anode
or the insoluble direct contact type anodes with the same bath. This new development
will make it possible to use conforming and auxiliary anodes for plating of complex
shaped configurations.
Deposit Characteristics.
Trivalent chromium baths produce deposits that are inherently microdiscontinuous.
Under about 0.65 micron, trivalent chromium deposits are microporous. Typical
density of the pores in a microdiscontinuous deposit is 20,000-60,000 pores/sq
cm. At higher thicknesses, deposits are microcracked.
The effect of microdiscontinuous
chromium plating is to dissipate electrochemical corrosion current over a wide
surface area, improving corrosion resistance.
Room-temperature and sulfate-type
trivalent chromium processes plate at rates similar to those of hexavalent chromium
baths—about 0.1 micron/min.
 |
| 5.
Cathode selector for use in reoxidation of trivalent chromium
|
The elevated-temperature
chloride process plates at about 0.25 micron/min.
The hardness of the deposit
is similar to that of traditional hexavalent chromium—about 700-1,000 Vickers.
Another advantage of the
trivalent chromium bath is its ability to tolerate current interruptions without
passivating or production of white “clouds” and hazes in the deposit.
Stripping and replating over nickel can be carried out easily with no adverse
effects.
Comparison of Effluent
Treatment for Cr+6 and Cr+3. As trivalent chromium plating baths contain no
hexavalent chromium, effluent treatment of the subsequent rinse water is both
simpler and cheaper. Most hexavalent chromium baths contain about 250 g/liter
of chromic acid, equivalent to 130 g/liter of chromium metal. Even if a dragout
rinse is used, the running-water rinses usually contain a high concentration of
Cr+6.
Effluent treatment consists
of acidification of the rinse water to obtain the required pH of 2.5, followed
by reduction of the Cr+6 to Cr+3, using sulfur dioxide or sodium bisulfite, according
to the following equation:
CrO3 + 2NaHSO3 + 2H2SO4
Cr2
(SO4)3 + Na2SO4 + 3H2
Finally the solution is
neutralized, causing precipitation of chromium hydroxide.
The theoretical requirement
is 3 kg of sodium bisulfite (60-62% SO2) plus 2-3 kg of sulfuric acid to reduce
1 kg of hexavalent chromium. A trivalent chromium electrolyte may contain only
5 g/liter of chromium and require only neutralization to achieve precipitation.
On precipitation, the volume of sludge generated by a hexavalent chromium electrolyte
is approximately 30 times greater than that from a trivalent bath.
A dilution of about 100
times with rinse water might produce an effluent from the plating process of about
50 ppm (mg/liter) of Cr+3 before any further dilution occurs from other sources
in the factory.
Hexavalent
Chromium Plating Troubleshooting Guide
Common
Plating Problems
Identifying the origin of a plating deficiency is the necessary first step
in solving the problem. The basic causes of poor plating usually fall into three
categories:
• Faulty bath chemistry;
•
Improper temperature and/or current density; and
• Poorly finished and/or
inadequately cleaned basis metal surface.
Skill and experience will
often permit a fairly precise identification of the source of any specific fault,
or at least suggest the likely category in which it will be found. However, chemical
analysis, Hull cell tests and reliable service recommendations give the best foundation
for successful troubleshooting. The most common defects are listed here with their
probable causes and some remedial steps.
| Milky
Deposit |
|
| Possible
Cause: |
Corrective
Step: |
| High chromic
acid/sulfuric ratio |
Increase
sulfate additions |
| Chloride
contamination |
Remove chloride
with silver carbonate |
| Iron contamination |
Dilute bath |
| Excess trivalent chromium |
Clean anodes and reoxidize
trivalent chromium |
| Poor nickel surface |
Carbon treat nickel to
remove organic contamination, improve rinsing of nickel and use a nickel activator |
| High temperature |
Reduce to normal, check
control |
| Hazy
Deposit |
|
| Possible Cause: |
Corrective Step: |
| High chromic acid/sulfate
ratio |
Increase sulfate concentration |
| High chloride contamination |
Remove chloride with silver
carbonate |
| Iron contamination |
Dilute bath |
| Excess trivalent chromium |
Clean anodes and reoxidize
trivalent chromium |
| Low temperature |
Increase temperature to
normal |
| Current density too high |
Adjust anode-to-cathode
ratio |
| Intermittent current flow |
Check electrical contacts |
| Poor nickel surface |
Improve rinsing and use
nickel activator |
| Gray
and Dull but Smooth Deposits |
|
| Possible Cause: |
Corrective Step: |
| High chromic acid/sulfate
ratio |
Increase sulfate concentration |
| Current surge when contact
is made |
Reduce current |
| High temperature |
Check temperature controllers |
| Dull
Spots in High-Current-Density Areas |
|
| Possible Cause: |
Corrective Step: |
| High chromic acid/sulfate
ratio |
Increase sulfate concentration |
| Passive nickel |
Improve rinsing and use
nickel activator |
| Bipolar condition |
Use live entry to chromium
bath |
| Blue
Deposits |
|
| Possible Cause: |
Corrective Step: |
| High temperature |
Reduce temperature to
normal |
| Rough
Deposits |
|
| Possible Cause: |
Corrective Step: |
| Low sulfate |
Add sulfuric acid to increase |
| Low temperature |
Adjust temperature to
normal |
| Surface preparation |
Improve cleaning and rinsing |
| Suspended particles in
bath |
Filter bath and eliminate
source |
| Burned
Deposits |
|
| Possible Cause: |
Corrective Step: |
| High chromic acid/sulfate
ratio |
Increase sulfate concentration |
| Low chromic acid |
Add chromium salts |
| Excess trivalent chromium
|
Clean anodes and reoxidize
trivalent chromium |
| Too high current density |
Reduce current density
or increase temperature |
| Low temperature
|
Increase temperature to
normal and preheat large, cold parts |
| Brown
Spots or Rainbows |
|
| Possible Cause: |
Corrective Step: |
| Low sulfate or catalyst |
Increase sulfate concentration
and submit sample for analysis |
| Inefficient contacts |
Check racking for build-up
on hooks and rack tips and proper contact on bus bars |
| Poor
Adhesion |
|
| Possible Cause: |
Corrective Step: |
| Insufficient etch |
Increase etch time and
check etch bath |
| Surface contamination |
Improve rinsing and/or
cleaning cycle |
| Intermittent contact |
Clean and check contacts
and work should enter chromium bath live |
| Poor nickel deposit |
Check surface preparation
before nickel plating and condition of nickel bath |
| Poor
Coverage |
|
| Possible Cause: |
Corrective Step: |
| Low chromic acid content |
Add chromium salts |
| Low chromic acid/sulfate
ratio |
Precipitate excess sulfate
with barium carbonate (See Table VI) |
| Plating current too low |
Raise current density |
| Oxidized contacts |
Clean contacts |
| Scaled anodes |
Clean anodes |
| High temperature |
Reduce temperature to
normal |
| Passive nickel |
Activate nickle surface
in nickel activator |
| Slow
Deposition Rates |
|
| Possible Cause: |
Corrective Step: |
| High chromic acid/sulfate
ratio |
Add the proper amount
of sulfuric acid |
| Too low current density |
Increase voltage; check
part distribution and check for current leakage |
| Scaled anodes |
Clean anodes |
| Oxidized contacts |
Clean contacts |
| Insufficient power supply
|
Increase rectifier size |
| Iron contamination |
Dilute bath |
| Excess trivalent chromium |
Follow procedure for the
reoxidation of trivalent chromium |
| Too high temperature |
Reduce to normal temperature |
| Partial
Deposition Rates |
|
| Possible Cause: |
Corrective Step: |
| Too low current density |
Increase voltage, clean
rack contacts and clean anodes |
| Uneven current density |
Improve arrangement of
parts on rack |
| Passive nickel |
Activate cathodically
or immerse in hydrochloric acid (50%) |
| Gas pockets |
Suspend parts so gas escapes
freely |
| No
Deposit |
|
| Possible Cause: |
Corrective Step: |
| Reverse polarity |
Make proper connections |
| Defective contacts |
Clean contacts |
| Excess sulfate |
Check ratio and correct |
| Chloride contamination |
Remove chloride with silver
carbonate |
| Pitted
Deposits |
|
| Possible Cause: |
Corrective Step: |
| Pitted nickel deposit |
Filter nickel bath |
| Pitting in basis metal
|
Improve basis metal preparation |
| Solution contamination
from |
Improve grinding and cleaning
of magnetic particles on ground surfaces procedure |
| Gas pitting |
Reposition work on racks
to avoid gas formation |
Trivalent
Chromium Oxidation
If
anode deficiencies and bath contaminants (iron, copper or other metal ions, unstable
mist suppressants or stray parts corroding on the floor of the tank) allow the
trivalent chromium concentration in the bath to exceed the recommended maximum
of around 2%, reoxidation is necessary.
Reoxidation of the Cr+3
requires that the bath be electrolyzed with clean (active) anodes, using an anode/cathode
area ratio of 30:1 and the highest bath temperature permissible. Occasionally
the electroplater can process loads of work using a high ratio of anode-to-cathode
area to salvage his bath. More often he will adopt one the three alternatives:
1. Periodic reoxidation
of bath by electrolysis.
2. Continuous reoxidation of bath by means of a reoxidation
cell within the plating tank.
3. Continuous reoxidation of the bath in a separate
reoxidation tank.
Regardless of the method
used, the reoxidation requires an anode current density of approximately 20 asf.
The cathode current density will then be about 600 asf, if the proper anode to
cathode area ratio has been maintained. Specific pointers on each of the three
alternative procedures follow.
Periodic
Reoxidation of Bath
Raise the plating-bath temperature to at least 145F, or to the highest temperature
permissible for the tank-lining material, and space the tank anodes evenly along
the anode bar. Position a small-diameter cathode rod (copper) between each pair
of anodes. The diameter/length relationship of the cathode rods should relate
to the effective anode area as indicated in Figure 5. In the event the cathode
is not of the same length as the anodes, the indicated length to be plated should
be centrally positioned. If necessary, mask or tape the top section to permit
proper positioning.
Electrolyze the chromium
plating bath until the Cr+3 concentration is down to about 1% of the chromic acid
concentration. The duration of the bath electrolysis will depend on the initial
Cr+3 concentration, the total anode area available for the particular bath volume
and the temperature of the bath. The efficiency of oxidation will decline as the
Cr+3 concentration drops. For example, less electrolysis will be needed to lower
the trivalent chromium level from 5% to 4% than to reduce it from 2% to 1%.
It may be necessary to
electrolyze the bath for several overnight periods or over a weekend to lower
the Cr+3 con-centration to the desired level (1% of the chromic acid present).
If the current/volume ratio is 5 amp/gal of solution, the anode current density
20 asf and the cathode current density 600 asf, it will take about 2 hr of electrolysis
(on the average) to reduce the Cr+3 concentration 0.1 oz/gal. PFD
REFERENCES
Dennis,
J.K. and Such, T.E., Nickel and Chromium Plating, Butterworth Publishers, 1986.
Canning, Handbook on Electroplating, 22nd edition, 1978. Salauze, J., Traite’De
Galvanoplastic, 2nd edition, 1950.
Zaki, N., “Advances in Trivalent
Chrome Plating,” AESF Chromium Colloquium, 1987.
| TABLE
I—Chromic-Acid-Based Plating Bath Parameters |
| Single-Catalyst
Baths |
| |
Decorative |
Hard |
| Chromic Acid |
225-300 g/liter |
250-400 g/liter |
| Chromic/Sulfate Ratio |
100:1 to 150:1 |
75:1 to 100:1 |
| Temperature |
35-46C |
49-65C |
| Current Density |
7.0-15 amp/dm2 |
22-100 amp/dm2 |
| Cathode Efficiency |
6-12% |
10-15% |
| Co-Catalyzed
and High-Speed Baths |
| |
Decorative |
Hard (heavy) plating |
| Chromic Acid |
210-270 g/liter |
200-300 g/liter |
| Chromic/Sulfate Ratio |
150:1 to 250:1 |
120:1 to 230:1 |
| Temperature |
35-55C |
43-55C |
| Currently Density |
7.0-15 amp/dm2 |
22-90 amp/dm2 |
| Cathode Efficiency |
10-16% |
15-22% |
| TABLE
II—Comparison of Working Parameters of Trivalent Sulfate Type Versus Hexavalent
Baths |
| |
Trivalent |
Hexavalent |
| Concentration of Chromium
(g/liter) |
5-6 |
100-250 |
| pH |
3.5-3.9 |
0 |
| Temperature (C) |
40-50 |
40-50 |
| Current Density (amp/dm2) |
4-9 |
10-15 |
Anodes: Shielded Anode
Insoluable Anode |
Lead (alloy) Composite
metal oxides |
Lead (alloy) |
| Throwing Power |
Good |
Poor |
| Reaction to Current Interruption |
Tolerant |
Causes “white wash” |
| Effluent |
Low level of Cr3 |
High level of Cr3 |
| Skin Contact
|
Mild effect, similar to
nickel |
Strong acid burn and ulceration
|
| Deposit Structure |
Microporous |
Induces microdiscontinuities |
| Plating Rate |
0.1 micron/min at 7 amp/dm2 |
0.1 micron/min at 10 amp/dm2 |
| TABLE
III—Metallic Impurities and Their Effects on Trivalent Baths |
| Metallic Impurity |
Effect Produced If
Exceeded |
Maximum Tolerance (mg/liter)
|
| Ni |
500 |
Darkening of deposit |
| Cr+6 |
30 |
Defects at low current
density |
| Cu |
30 |
White blooms at high cd |
| Zn |
70 |
Darkness at low current
density |
TABLE IV—Working
Parameters of Single-Cell Trivalent Baths
Room Elevated Temperature Temperature
Concentration of Chromium (g/liter) 15-25 15-25
pH 2.8-3.5 2.3-2.9
Temperature
(C) 20-22 27-44
Current Density (amp/dm2) 8-13 8-13
Maximum Thickness
millionth 50 1,500+
Anodes Graphite Graphite
Line of Anodes Indefinite
Indefinite
Throwing Power and Covering Power Better than hexavalent Better
than hexavalent
Reaction to Current Interruption Tolerant Tolerant
Effluent
Low levels of Cr3 Low levels of Cr3
Misting None None
Skin contact Mild
effect, similar Mild effect, similar to nickel to nickel
Deposit Structure
less than 25 millionth Microporous Microporous greater than 25 Microcracked Microcracked
Plating Rate 4 millionths/min 10 millionths/min
Filtration Only to remove
solids Only to remove solids
TABLE V—Conversion
of Excess Sulfate to Barium Carbonate Required
Bath Volume (gal)
100 200
300 400 500 600 700 800 900 1000
Barium Carbonate Required (oz)
0.01 2.2
4.4 6.6 8.8 11.0 13.2 15.4 17.6 19.8 22.0
0.02 4.4 8.8 13.2 17.6 22.0 26.0
30.8 35.2 39.6 44.0
0.03 6.6 13.2 19.8 26.4 33.0 39.6 46.2 52.8 59.4 66.0
0.04 8.8 17.6 26.4 35.2 44.0 52.8 61.6 70.4 79.2 88.0
0.05 11.0 22.0 33.0
44.0 55.0 66.0 77.0 88.0 99.0 110.0
0.06 13.2 26.4 39.6 52.8 66.0 79.2 92.4
105.6 118.8 132.0
0.07 15.4 30.8 46.2 61.6 77.0 92.4 107.8 123.2 138.6 154.0
0.08 17.6 35.2 52.8 70.4 88.0 105.6 123.2 140.8 158.4 176.0
0.09 19.8 39.6
59.4 79.2 99.0 118.8 138.6 158.4 178.2 198.0
0.10 22.0 44.0 66.0 88.0 110.0
132.0 154.0 176.0 198.0 220.0
Note: 1 oz/gal = 7.5 g/liter
TABLE VI—Conversion
of Excess Sulfate to Barium Carbonate Required
Bath Volume (gal)
100 200
300 400 500 600 700 800 900 1000
66 Degrees Bé Sulfuric Acid Required
(fl oz)
0.01 0.5 1.0 1.6 2.1 2.6 3.1 3.7 4.2 4.7 5.2
0.02 1.0 2.1 3.1 4.2
5.2 6.3 7.3 8.4 9.4 10.4
0.03 1.6 3.1 4.7 6.3 7.8 9.6 10.9 12.5 14.1 15.7
0.04 2.1 4.2 6.3 8.4 10.4 12.5 14.6 16.7 18.8 20.9
0.05 2.6 5.2 7.8 10.4
13.0 15.6 18.2 20.9 23.5 26.1
0.06 3.1 6.3 9.6 12.5 15.6 18.8 21.9 25.0 28.2
31.3
0.07 3.7 7.3 10.9 14.6 18.2 21.9 25.6 29.2 32.9 36.5
0.08 4.2 8.4
12.5 16.7 20.9 25.0 29.2 33.4 37.6 41.8
0.09 4.7 9.4 14.1 18.8 23.5 28.2 32.9
37.6 42.3 47.0
0.10 5.2 10.4 15.7 20.9 26.1 31.3 36.5 41.8 47.0 52.2
Note:
Fluid ounces × 29.5737 = cubic centimeters