Atotech has signed agreements with Case Western Reserve University to enhance development of the company’s global metallization technology, and support its material science and application failure analysis activities in Europe, Asia and the United States.
The university’s department of Materials Science and Engineering and its Institute of Advanced Materials will further strengthen Atotech’s chemistry and analytical capabilities, the company says.
Atotech sponsors 16 technology centers, including a semiconductor chemistry R&D and application center at the College of Nano-scale Science and Engineering in Albany, N.Y. Each site is responsible for supporting local and international development and optimization of plating chemistries for tailored regional processes and applications. According to Atotech, the department of Materials Science and Engineering at CWRU has the ability to use high-resolution instruments to support nano-scale inspections as well as failure and property analysis, including trace element analytics.
Atotech will establish an organic chemistry laboratory dedicated to supporting new plating additive development specialized for small-scale feature plating. This laboratory is expected to further enhance the company’s semiconductor R&D activities, which focus primarily on the optimization of copper plating process solutions using advanced polymers for structures down to the 22-nm node. Additional research is being performed on plating process development for sub-22-nm node structures.
Also through these contracts, Atotech and CWRU will work to develop new chemistries and processes for manufacturing smaller semiconductor devices than have previously been possible in routine production. According to the company, such smaller semiconductors are critical to the fabrication of more powerful and more capable computers, phones and other electronic devices.