MTConnect Institute, OPC Foundation Release MTConnect Companion Specification

News Item From: MoldMaking Technology

Posted on: 11/26/2013

The MTConnect Institute and the OPC Foundation have developed a companion specification release candidate for MTConnect that is compatible with the OPC Unified Architecture (UA) standard.

The MTConnect Institute and the OPC Foundation have developed a companion specification release candidate for MTConnect that is compatible with the OPC Unified Architecture (UA) standard. The MTConnect-OPC UA specification defines a standard set of interfaces, methods and objects for use in process control and manufacturing automation applications to facilitate interoperability. This information model can be used by manufacturing technology equipment, devices, software or other products that implement those standards.

In September 2010, the MTConnect Institute and the OPC Foundation signed a memorandum of understanding to work together to provide a mechanism for OPC and MTConnect to collaborate to extend the reach of the existing manufacturing data exchange standards and implementation technologies. To facilitate wide and rapid adoption by vendors of equipment and software, the MTConnect-OPC UA companion specification is designed with the following goals in mind: incremental adoption, evolution, customizability and remaining non-proprietary in nature.

The release candidate is based on and fully compatible with MTConnect version 1.2 and OPC UA version 1.02. It is available for download from MTConnect Institute’s companion specifications page.


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