Introducing CU 2800, an advanced acid copper electroplating process specifically engineered for improve leveling of high aspect ratio PCBs at reduced plating times. Using an innovative, proprietary brightener compound, CU 2800 provides significantly improved throwing power making it possible for faster plating times. Unlike other high throw formulations, CU 2800 provides deposit leveling without the use of traditional stress inducing leveling agents. The end result is a fine grain deposit exceeding the performance requirements of the most advanced PCB structures. All CU 2800 components are fully analyzable using the company's Electrochemical Bath Analyzer (EBA) as well as other established quantitative methods.