The process is an excellent pre-plate copper strike for bright nickel, acid copper, tin and solder plates. It is an excellent heat treat stop off plate and EMI shield. It is also an excellent decorative finish for buttons, rivets, lighting fixtures and builders’ hardware. The copper plate can be readily blackened or oxidized for a variety of attractive antiqued finishes.
It is said to have no carbonates that need to be treated nor contain strong chelators. It is supplied as a liquid concentrate which is diluted with water.
The plating process produces a fine grained, smooth, dense and ductile copper deposit which is nonporous and has excellent bonding properties. It is designed to be the next generation process to E-Brite 30/30 process and works in rack or barrel processes.