Chemetall’s Gardobond CU 7600 and 7602 technologies apply copper barrier layers to substrate materials like iron and zinc and their alloys, preparing them for further galvanic coating.
According to the company, these technologies are more environmentally friendly and use less energy than traditional copper- or nickel-plating processes. They do not contain strong complexing agents such as cyanide, EDTA or HEDTA, or heavy metals other than copper. They also are free from organic or inorganic stabilizing agents and do not require reducing agents such as formaldehyde, hydrazine or hypophosphite. The technologies operate at ambient temperature and do not need external power input.
While CU 7602 generates glossy copper layers, CU 7600 produces matte surfaces. Both technologies are suitable for a variety of industrial sectors, such as the automotive industry and production of welding rods and fittings.