Specially formulated for ABS and ABS/PC decorative plating on plastics (POP) applications, Enthone’s Udique DP Plus direct metallization process eliminates the electroless nickel or copper, as well as the immersion copper and nickel or copper strike steps required in conventional POP pretreatment processes. This results in decreased energy and water consumption, and eliminates associated labor and waste treatment requirements. Reduced palladium content in the activator working solution also provides a lower operating cost and higher yields. A highly stable conductor imparts a uniform layer on the plastic surface for subsequent acid copper plating.
The Udique DP Plus process is also suitable for plating some polypropylene (PP) materials. It can be used for selective plating (2K and 3K components) or with a stop-off lacquer. Udique DP Plus is specially engineered for use with Enthone’s copper-nickel-chrome systems, including Cuprostar acid coppers, Epelyt bright and matte nickels, and Pearlbrite satin nickel, as well as Trilyte trivalent and Ankor decorative chrome processes.
The process is engineered to provide excellent adhesion on complex part geometries such as sharp borderlines and edges predominant in the manufacture of today’s advanced automotive, building hardware and decorative packaging designs.