EPi’s Non-Cyanide Solution Produces Ductile Copper Deposits

This solution is free of chelating agents and is formulated to produce a fine-grained, nonporous ductile copper deposit.

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EPi, E-Brite 5.0 Cu


EPi will have E-Brite 5.0 Cu, E-Kleen SR and Kool-Blak 225 on display at Sur/Fin. E-Brite 5.0 Cu, EPi’s fifth generation alkaline non-cyanide process that can successfully plate Zamac No. 3/zinc diecasts in barrel plating passing 350°F bake adhesion test. The resulting copper plate can be acid copper or nickel plated over. E-Kleen SR removes carbonaceous smut from ferrous substrates, and comes in soak and electroclean formulations to save money and eliminate cleaning rejects. Kool-Blak 225 is a mid-temperature true black oxide process for 220–245°F, resulting in a true magnetite Fe3O4 without smut and rub-off.

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Automated Selective Plating Takes Off With Safran Project

Sifco ASC has partnered with Safran on various surface finishing projects for more than 20 years, including recent work to increase wear resistance on an aircraft’s axles.