Internal mold release for dicyanamide-cured epoxies

New Product Announcements From: CompositesWorld

Posted on: 1/30/2013

Axel Plastics Research Laboratories has announced two new internal mold release additives for DICY (dicyanamide)-cured epoxy resin: MoldWiz INT-1322 and INT-1329.

Axel Plastics Research Laboratories (Woodside, N.Y.) has announced two new internal mold release additives for DICY (dicyanamide)-cured epoxy resin: MoldWiz INT-1322 and INT-1329. Axel says that by nature, DICY-cured epoxies are among the most tenacious in their bonding properties, prompting many in the industry to search for more effective ways to release DICY epoxy, resins, compounds, prepregs and laminates. Axel says MoldWiz INT-1322 has been proven to have no impact on the cure kinetics of imidazole- or amine-accelerated DICY. For non-accelerated DICY-cured epoxy resin, Axel offers INT-1329, which is formulated for the higher process temperatures associated with these DICY systems. Axel says initial evaluations indicate that these products have a good pot life in resin mixes and provide good release from molds and substrates. They are comprised of organic fatty amine and acid derivatives with surface active agents. The products are 100 percent active and generally effective at addition levels of 0.5 to 4.0 percent, based on resin system weight and dependent on process and fillers.


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