Metal Chem’s Plating Process Designed for Metallic and Non-Metallic Substrates

The company says this product provides excellent electrical conductivity and low contact resistance, benefitting electrical applications.

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Metal Chem Inc.’s Meta-Plate 1000 is an electroless nickel boron plating process designed to deposit a smooth, hard, semi-bright nickel boron coating onto a variety of metallic and non-metallic substrate. This DMAB-based electroless nickel system is engineered for welding, soldering and brazing applications. The company says this product provides excellent electrical conductivity and low contact resistance, benefitting electrical applications.