Plating Process Accommodates Components as Small as 0.25 Inches

The SBE (Spouted Bed Electroplater) is Technic Inc.’s process for plating small components such as connectors, pins, chips and other types of small parts with advantages over conventional barrel plating.

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The SBE (Spouted Bed Electroplater) is Technic Inc.’s process for plating small components such as connectors, pins, chips and other types of small parts with advantages over conventional barrel plating. Parts with dimensions no larger than 0.25" (6.35 mm) in any one direction are processed with a significantly reduced amount of conductive media, helping reduce costs and increase production. Load sizes range from 50 to 500 mL and can be incorporated into both manual “wet-bench-style” operations as well as fully automatic hoist lines.

The SBE plating chamber’s design allows for rapid circulation of parts over the cathode current feeder without the use of any mechanical movement. Plating solution flow rates as high as 60 L per min. carry the parts through the chamber, ensuring that the parts are always plated in “fresh solution” irrespective of the configuration and size.