Post-treatment Plating Process

Betatec is a neutral, water soluble post-treatment process especially developed for Ni-Au and Ni-Pd Ni-Au metal surfaces.

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Betatec is a neutral, water soluble post-treatment process especially developed for Ni-Au and Ni-Pd Ni-Au metal surfaces. Atotech claims it will significantly improve corrosion resistance of the deposits and contribute to the reduction of gold costs. The company reports the product promotes the hydrophobicity of the gold surface, blocks existing pores and improves the corrosion resistance of the plated metal layer system during storage, thus maintaining conductivity and solderability standards. The coatings will withstand extensive heat treatments, do not increase the electrical contact resistance of the treated surface, and do not affect the wire bondability of soft Au surfaces.

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