Pure Palladium Deposit Features High Ductility, Low Stress for Connector Applications

Technic introduces Pallaspeed 990, a new pure palladium electroplating process for high-volume electronic applications.

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Technic announces the release of Pallaspeed 990, a new pure palladium electroplating process for high-volume electronic applications. Pallaspeed 990 produces a high ductility/low stress, bright deposit with no microcracking in thicknesses ranging to 4 µm. According to the company, the process features a neutral pH with no ammonia smell and offers a wide current density range with a stable electrolyte.

The process incorporates a minimal amount of hydrogen during plating, the company says, which eliminates cracking of the deposit. Pallaspeed 990 is a fully analyzable process with UV/VIS procedures for additive control. The process is stable with a greater than 5 metal turnover (MTO) bath life.

The product also offers superior corrosion resistance, and with the high ductility of the deposit, the process is designed for mobile phone “quick charge” connectors and any situation where regular manual connectivity is required.

For more information, visit technic.com.

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