Semiconductor Detector with Digital Signal Pulse Processing

New Product Announcements From: Products Finishing

Posted on: 4/7/2005

The X-ray fluorescence coating thickness and composition measurement tool called the HiSpex is designed to measure metal film thickness and compositions along with the determination of elemental composition of solids.

The X-ray fluorescence coating thickness and composition measurement tool called the HiSpex is designed to measure metal film thickness and compositions along with the determination of elemental composition of solids. The instrument uses an electrically cooled Silicon Pin-Diode detector coupled with superior digital signal pulse processing. The result is a significant improvement in detection resolution, excellent multi-channel analyzer stability and production-friendly solid state detector performance. It is said to be an excellent choice for more demanding coating applications where films below 1000 angstroms (4 µin) are employed and/or binary and ternary alloy stacks are required and where complex alloy coatings and/or base materials need to be determined. Key Features of the tool include measurement of extremely thin coatings, measurement of complex alloys, especially where peak element overlap exists and excellent sensitivity and electrical stability for thin coatings and complex alloys.

 


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