Technic’s SBE Eliminates Tin and Nickel Deposits

The chamber of the Sprouted Bed Electrode is designed for rapid circulation of parts over the cathode current feeder without the use of any mechanical movement.

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Technic Inc., Spouted bed Electrode

 

Technic Inc.’s Spouted Bed Electrode (SBE) is designed as a method of electroplating small components such as electronic connectors, pins, chip capacitors and chip resistors. This system is engineered for load sizes between 50 and 500 milliliters using less conductive media. The chamber of the SBE is designed for rapid circulation of parts over the cathode current feeder without the use of any mechanical movement. The SBE is designed to eliminate tin and/or nickel deposits in the screened area of the chamber

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