X-Ray Measures Plating Thickness

New Product Announcements From: Products Finishing

Posted on: 1/13/2011

UPA Technology's line of X-ray instruments for plating thickness measurement is designed with three-chamber versions that make it easy to measure items of any size.

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X-Ray System for Plating Measurement

X-Ray System for Plating Measurement

UPA Technology's line of X-ray instruments for plating thickness measurement is designed with three-chamber versions that make it easy to measure items of any size––from small connectors to large parts or circuit boards.

Features include laser focusing, point and measure, EZ loading programmable stages, 3D mapping of plating thickness, and plating solution analysis. The X-ray tube shuts off between measurements, eliminating the need for a mechanical shutter and extending X-ray tube life. 

User-friendly software with drop-down menus and Microsoft Windows XP operating system allows direct data transfer to an Excel program, the company says. Operators can chose between five standard print formats for customized reports.


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