CLICK IMAGE TO ENLARGE (+)
x-ray testing
UPA Technology will display its full line of X-ray instruments for accurate plating thickness measurement. Three chamber versions allow measurement for a variety of part sizes––from small pins to large parts or even circuit boards.
These easy-to-use X-ray instruments offer many advanced features such as programmable XYZ stages, laser focusing, point and measure, EZ loading stage, 3-D mapping of plating thickness, and plating bath analysis.
Learn More
Editor's Picks
Sur/Fin 2011
The 93rd Annual Sur/Fin, sponsored by The National Association for Surface Finishing, is r...
Related Suppliers
UPA Technology, Inc.
Zones
Plating
Supplier Categories
Plating
Loading the player ...
