Non-destructive Measurement of Protective Coatings in Car Body Cavities

Provided By Fischer Technology, Inc.

Modern corrosion protection of car bodies is usually made by cathodic dip priming (CDP). But up to now it was more or less impossible to measure such thin coatings non-destructively inside hardly accessible cavities like girders, stiffeners or cross beams. Now the FISCHER specialists for coating thickness measurement are introducing a new cavity probe which solves this problem.
The new probe V3FGA06H - especially designed for the automotive industry - has a curved slim shape and a small, flexible attached probe head. Thereby the probe fits through small openings in the car body to measure coating thickness at areas which were not accessible up to now. Due to the flexible probe head`s smart kinematics a precise placing and measurement is guaranteed, whether in “blind” mode or on beveled areas.
The new cavity probe V3FGA06H is compatible with the FMP-gauges from FISCHER. Along with the DUALSCOPE FMP100 it is best suited solution for a professional quality control.
 

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FMP Series – Coating Thickness Measurement Instruments

Provided By Fischer Technology, Inc.

Fischer Technology, a U.S. manufacturer of coating thickness, material testing, and material analysis instrumentation coating thickness gauges. Fischer instruments are designed with built-in measurement reporting to meet the requirements set forth by SSPC PA2 and IMO PSPC. They can measure thin or thick coatings, soft coatings, duplex coatings, marine coatings, fireproof coatings, coatings applied to bridges, water tanks, vessels and other steel structures. They are easy to use and versatile with a large and bright graphic display and an extremely durable shock resistant casing. These thickness gauges can measure over ferrous, non-ferrous, or both ferrous and non-ferrous substrates. 

The large selection of Type 2 interchangeable probes are extremely accurate and have a wide measurement range designed for hard to reach areas, curvatures, surface roughness and even underwater measurement. Type 2 probes
• Display summarizes SSPC PA2 Mode which includes the number of gauge readings and the number of spot readings in an area
• Display demonstrates 80% - 120% rule. No single spot measurement shall be less than 80% of specified minimum thickness and no single spot measurement shall be more than 120% of specified maximum thickness.
• Information including the average thickness of all spot measurements is displayed
• Explanation of Area measurement statistical values listed in screen shot
• Spot measurements summary including date and time of measurements

In addition, Fischer offers the MP0R/MP0 Series which is a small handheld unit with an internal probe, two large displays, automatic substrate recognition, and like the FMP Series, is also precise, robust, and easy to use.

You will find the appropriate instrument in the new FMP family to fit your measuring application. The instrument type is determined based on the coatings to be measured and their respective substrate materials.

Fischer provides certified calibration foils and other standards. Measurement methods available by Fischer include: X-ray fluorescence, beta backscatter, magnetic induction, eddy current, and coulometric. Fischer also offers solutions for micro-hardness, conductivity, ferrite content, and porosity testing.
 

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XRF For "High Reliability" Electronic Components

Provided By Fischer Technology, Inc.

Aviation, Aerospace, and Military users of commercial off the shelf components are faced with a potentially dangerous parts shortage.  It is possible that electronics thought to contain 3% tin lead specified for high reliability applications will be mislabeled and replaced with 0% lead components. As a result, tin-whiskers could occur resulting in dangerous consequences.

The EU directives WEEE and RoHS have drastically changed the types of components supplied to many industries including electronic equipment, printed circuit boards and plastics. Those categories of electrical and electronic equipment that are exempt from WEEE and ROHS face an even tougher and more critical challenge which could be the difference between life and death.

As of July 2006, the use of lead containing solders in some electronic and electrical equipment has been prohibited. Exempt from this ban are parts for “High Reliability” military, aerospace and aviation applications. Since the “High Reliability” portion of the overall market for solder is quite small, many suppliers converted their production lines to the manufacture of only lead-free solder. As a result there are fewer sources for the 3% lead solder that for decades has been the standard means of preventing tin whiskers. Without tin/lead solder, parts exposed to harsh environments such as high humidity, vibration and temperature variation could short circuit causing fatal failures.

How does one guarantee a critical part contains at least 3% lead?

Ensuring a critical part contains at least 3% lead or other alloying elements can be accomplished with an X-ray fluorescence measurement instrument. A quick, reliable and non-destructive method for critical component identification for >3% lead has been developed by Fischer Technology, Inc. Using X-ray fluorescence combined with the state of the art Win FTM® 6 Software components can be clearly identified. By using this method, one can avoid the risks that might result should a parts supplier change to lead-free solder while maintaining the same part number. In addition, XRF measurement eliminates the risk that mixed lots in which some parts contain necessary lead while others are lead-free are shipped without being identified. Also, the X-ray fluorescence equipment will ensure in rework and repair situations that a lead-free component is not used to replace a required lead containing product. Our material analysis instruments FISCHERSCOPE® X-RAY, XAN® and XDAL® help you target components that are lead-free using X-ray fluorescence in many different fields of applications. They provide an effective solution giving accurate levels of lead solder in products such as printed circuit boards and all electrical and electronic equipment. The instruments are easy to operate and safe. They provide fast, reliable, and easily readable results which can be obtained by operators with very little experience.  If the part contains the necessary percentage of lead, the part is immediately identified as passing.

A screening process can be implemented to alleviate the risk of mixed lots. In addition the X-ray fluorescence equipment is capable of identifying the contents of the hazardous substances Pb, Hg, Cd, Cr and Br described in the EU directives WEEE and RoHS.

A high resolution video camera is included in the measuring instrument. This optical system, together with some variable collimators which control the X-ray beam, enables the analysis of the smallest specimen. The XDAL® instrument provides an extremely easy and user-friendly way to enable automatic measurements of specimens on a large scale. Apart from the screening of the parts, the XRF also enables an accurate quantitative analysis. Our detection limits are Pb, Hg, Br < 10 ppm; Cd, Cr < 20 ppm. The measuring time, dependant on the object, ranges from 50 s – 200 s.

Fischer Technology • 1-800-243-8417 • www.Fischer-Technology.com

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