UPA Technology – Sur/Fin 2014, Booth 643
UPA Technology will showcase its line of x-ray instruments for plating thickness measurement, and RoHS and elemental analysis.
UPA Technology’s XRF-2000 x-ray coating thickness gage is available in three chamber versions to measure parts ranging from small connectors to large plated parts and even circuit boards.
UPA Technology will display its full line of X-ray instruments for accurate plating thickness measurement.
Please visit: UPA Technology, Inc.
8963 Cincinnati-Columbus Rd.
West Chester, OH 45069 US