With a short dwell time (as little as 4 seconds), this product is formulated for reel-to-reel processing.
Umicore Sealing 691 leaves technical characteristics unaffected.
Valentine hopes to further advance the implementation of Six Sigma principles within Uyemura.
This cleaner is designed as a drop-in replacement process for conventional vertical copper electroplating applications.
These additions will increase capability and capacity to its US infrastructure.
“These individuals—all of them highly experienced in their specialties—are excellent additions to our team,” says Walsh.
Developments in the world of printed circuit boards.
Engineered nanopolymers absorb on the metal surface, crosslinking to form an invisible, undetectable layer.
Scott Griggs and his company, International Process Technologies LLC, will represent the company’s technologies in the Upper Midwest.
Two new high-speed electrolytes for the electrodeposition of nickel phosphorus are Umicore Niphos 967 and 968.
Wisconsin manufacturer of printed circuit boards for the LED lighting industry and others in the electronics sector has seen business boom in the past few years.
Under the terms of the multi-year agreement, eSurface and Uyemura will market and deliver each other's products and services to existing and future customers and licensees.
eSurface and Uyemura will co-market products and services to existing and future customers.
Uyemura – Sur/Fin 2014, Booth 413
Anthony Albino and Joseph Mirando join plating supplier's R&D team.
Uyemura International Corp. (Southington, Conn.) and Europlasma NV (Oudenaarde, Belgium) have formed a partnership to bring advanced vacuum plasma treatment technology (Nanofics) to electronic manufacturing companies and board-makers in the U.S., Canada and Mexico.
Houston plater specializes in finishing private aircraft interiors; company offers more than 130 standard finishes and unlimited custom-matching capabilities.
Uyemura has appointed Kathleen Larson as a lab chemist in its Tech Center.
Uyemura will showcase its mirror-like Miralloy 2851 electroplating alloy, an alternative to silver, palladium and nickel that is heavy metal-free, tarnish-free and abrasion-resistant.
Uyemura International Corp. has hired Mark Eonta as Southeastern Territory manager. He also will act as product manager for the MEC chemistry that Uyemura distributes throughout North America.
Please visit: Uyemura International
240 Town Line Rd.
Southington, CT 06489 US
"Powered by science, focused on customers."
At Uyemura, our mission is the development, and continuous improvement, of chemistries and equipment that enhance the performance, productivity and profitability of the companies we serve.
Miralloy is industry's best and most cost-effective alternative to silver, palladium and nickel for a broad range of applications. In 2013, Uyemura introduced Miralloy 2851, a revolutionary process that operates at 10 ASF - 25-43% faster than competitive products. More
GRX-70 Whiskerless Tin is an acidic electroplating tin bath proven to prevent whiskers formation in electroplated tin for at least 22,000 hours. GRX-70 has a high deposition speed, produces a uniform white matte deposit with excellent solderability, and operates at 113-152°F. More
Sealing 691 Preserves Metal Brightness Indefinitely, also seals thin gold's inherent porosity Organic Nanotechnology Process has a short dwell time - as little as 4 seconds, compared to competitive products at approximately 30 seconds – and is ideally suited to reel-to-reel processing. More
CL-NC Alkaline Copper is the first-ever solution for direct plating on aluminum. CLNC replaces the cyanide copper strike used prior to zinc die cast plating, and is ideal as a base for bright nickel / microcrack chrome finishing. Used with a nickel barrier, it's an excellent base for gold plating. More