“Lumpy” Stannate Tin
I am having problems plating stannate tin on parts that have a copper flash. Parts are “lumpy” and dewetted.
Q. I am having problems plating stannate tin on parts that have a copper flash. Parts are “lumpy” and dewetted. What do you think is the problem? A.G.
A. I would start by looking at your stannate tin plating steps. A tin strike at 40–60 ASF for approximately 1 minute and then plating at 30 ASF for the required time is pretty much the standard process. Assuming this is the general procedure you are using, here are some possible causes for your “lumpy” deposit:
| Problem | Possible Cause |
|---|---|
| Rough deposit | Stannite ions present in the bath.
|
| Spongy deposit | Stannite ions present in the bath.
|
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