Immersion tin and lead-free hot air solder leveling (HASL) coatings based on SnCu or SnAgCu alloys are widely used as surface finish materials for printed circuit boards (PCB). These coatings prevent the underlying copper from corrosion and preserve its solderability during lead-free assembly processes and for a long storage life of PCBs.
#research #pollutioncontrol #electronics
A dynamically software controlled electroplating tooling concept has been developed to compensate the pattern dependence of the deposited layer thickness on different substrates. In this paper a validation of this new tooling concept on industry relevant printed circuit boards is presented. Simulations are compared with experimental results as obtained in a prototype electroplating cell. A quantitative improvement of the plating thickness uniformity between a standard electroplating cell and the advanced tooling approach is given. The influence of the conductivity of the electrolyte on the deposit distribution is studied and indicates a way to obtain a significant improvement in uniformity.
Well-designed ultrasonic cleaning systems have a proven track record of delivering gentle yet thorough parts-cleaning without regulated solvents to industries as diverse as aerospace, electronics, automotive and coating.
#aerospace #automotive #electronics
The global printed circuit board industry has experimented with various solderability preservatives including organics, immersion tin, immersion silver, electroless nickel/immersion gold and others. This article examines the strengths and weaknesses of each...
Precision Plating adopted a new technology for processing its flat rolled sheet metal in strip-coil form…