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4/16/2013

Dimethylamine Borane for Electroless Metal Deposition

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Boron Specialties will demonstrate its use of dimethylamine borane (DMAB) as a mild, water-soluble reducing agent in process baths for electroless deposition of metals such as copper, gold and nickel onto metals, plastics and other substrates.

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Boron Specialties will demonstrate its use of dimethylamine borane (DMAB) as a mild, water-soluble reducing agent in process baths for electroless deposition of metals such as copper, gold and nickel onto metals, plastics and other substrates. DMAB is also used in printed circuit board production for post-treatment of surface cupric oxide.

DMAB is said to avoid “pink ring” defects in later-stage acid treatments by reducing the copper oxide layer to metallic copper, while retaining surface texture for stronger resin bonding. 

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