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4/29/2009

Element Analysis

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UPA Technology will display its XRF 2000R dual system X-Ray for element analysis and plating thickness measurement.

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UPA Technology will display its XRF 2000R dual system X-Ray for element analysis and plating thickness measurement. According to the company, no sample preparation is required for assay of gold and precious metal alloys is quickly achieved with. Fast, accurate and non-destructive multiple element analysis is obtained from 0.1ppm - 100wt%.  RoHS, WEEE and ELV compliance testing is performed using optimized analysis applications. Thin metal films and complex multi-layer deposits are easily measured with a minimum of calibration standards.     

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