EPi’s Non-Cyanide Solution Produces Ductile Copper Deposits

This solution is free of chelating agents and is formulated to produce a fine-grained, nonporous ductile copper deposit.

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EPi, E-Brite 5.0 Cu


EPi will have E-Brite 5.0 Cu, E-Kleen SR and Kool-Blak 225 on display at Sur/Fin. E-Brite 5.0 Cu, EPi’s fifth generation alkaline non-cyanide process that can successfully plate Zamac No. 3/zinc diecasts in barrel plating passing 350°F bake adhesion test. The resulting copper plate can be acid copper or nickel plated over. E-Kleen SR removes carbonaceous smut from ferrous substrates, and comes in soak and electroclean formulations to save money and eliminate cleaning rejects. Kool-Blak 225 is a mid-temperature true black oxide process for 220–245°F, resulting in a true magnetite Fe3O4 without smut and rub-off.