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8/9/2005

Infrared Reflow System

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This complete line of Infrared Reflow System support the environmentally important lead-free manufacturing initiative in the Electronics Industry.

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This complete line of Infrared Reflow System support the environmentally important lead-free manufacturing initiative in the Electronics Industry. Connector manufacturers commonly use solder to create inexpensive finishes that can be soldered. Pure tin is a cost effective replacement for lead bearing solder, but must be stress relieved after electrolytic application to avoid whisker formation. The system uses infrared energy to melt the plated deposit. Upon solidification the stresses that cause whiskers have been eliminated. Standard systems are available for line speeds of 5-60 feet per minute.

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