Plating Eductors Maximize Solution Shearing Action at Part Surface

At Fabtech 2017, Bex will display plating eductors, which create turbulent solution flow without air spargers or impellers, both of which are said to introduce air, steam and contaminants into plating tanks.

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Bex Inc. will display plating eductors, which create turbulent solution flow without air spargers or impellers, both of which are said to introduce air, steam and contaminants into plating tanks. The eductors are designed to maximize solution shearing action at the surface of the part to be plated. Optimized solution flow improves throwing power, the company says.

The eductors’ venturi design enables smaller pumps to circulate large volumes of tank solution, circulating as much as five times the pump output, with a discharge plume broader than jets from a solid stream nozzle of equivalent energy, the company says. Eductors with ¼" to 3" ports can discharge as much as 1,410 gpm at 50 psi.

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