Pure Palladium Deposit Features High Ductility, Low Stress for Connector Applications

Facebook Share Icon LinkedIn Share Icon Twitter Share Icon Share by EMail icon

Technic introduces Pallaspeed 990, a new pure palladium electroplating process for high-volume electronic applications.

Related Suppliers

Technic announces the release of Pallaspeed 990, a new pure palladium electroplating process for high-volume electronic applications. Pallaspeed 990 produces a high ductility/low stress, bright deposit with no microcracking in thicknesses ranging to 4 µm. According to the company, the process features a neutral pH with no ammonia smell and offers a wide current density range with a stable electrolyte.

The process incorporates a minimal amount of hydrogen during plating, the company says, which eliminates cracking of the deposit. Pallaspeed 990 is a fully analyzable process with UV/VIS procedures for additive control. The process is stable with a greater than 5 metal turnover (MTO) bath life.

The product also offers superior corrosion resistance, and with the high ductility of the deposit, the process is designed for mobile phone “quick charge” connectors and any situation where regular manual connectivity is required.

For more information, visit technic.com.

Editor Pick

NY/NJ's Masters Association of Metal Finishers Honors Members

Honorees included Walter Schwartz, who received the Award of Special Recognition for his work in the industry, and New Brunswick Plating, which received the Stephen Candiloro Memorial Award.

Related Topics