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12/8/2015

Uyemura's Acid Cleaner Replaces Copper Plating Applications

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This cleaner is designed as a drop-in replacement process for conventional vertical copper electroplating applications.

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Uyemura’s Thru-Cup MSC-PS acid cleaner is designed for enhanced cleaning and increased wetting of high-aspect ratio plated through holes and microvias. The detergency and low surface tension provide electroplated copper adhesion, and void-free coverage. This cleaner is designed as a drop-in replacement process for conventional vertical copper electroplating applications with minimal copper etching.

For more information about Uyemura International, visit uyemura.com

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