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4/17/2013

X-Ray Instruments for Measuring Thickness

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UPA Technology will showcase its line of x-ray instruments for plating thickness measurement, and RoHS and elemental analysis.

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UPA Technology will showcase its line of x-ray instruments for plating thickness measurement, and RoHS and elemental analysis. The devices are available in three chamber versions for measuring parts ranging from small connectors to large plated parts and circuit boards. Features include laser focusing, point and measure, easy-load sample stages and plating bath analysis. The user-friendly software includes drop-down menus and a Microsoft-based operating system that enables direct transfer of measurement data to Excel. Operators can instantly review and print from any of five standard report formats for color enhanced graphics, statistics and measurement data.  

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