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5/6/2011

X-Ray Systems for Plating Thickness Measurement

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UPA Technology will display its full line of X-ray instruments for accurate plating thickness measurement.

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UPA Technology will display its full line of X-ray instruments for accurate plating thickness measurement. Three chamber versions allow measurement for a variety of part sizes––from small pins to large parts or even circuit boards.

These easy-to-use X-ray instruments offer many advanced features such as programmable XYZ stages, laser focusing, point and measure, EZ loading stage, 3-D mapping of plating thickness, and plating bath analysis.
 

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