Immersion tin and lead-free hot air solder leveling (HASL) coatings based on SnCu or SnAgCu alloys are widely used as surface finish materials for printed circuit boards (PCB). These coatings prevent the underlying copper from corrosion and preserve its solderability during lead-free assembly processes and for a long storage life of PCBs.
#research #pollutioncontrol #electronics
The Leading Edge Guide to Top Quality Anodizing using the Complete Spectrum Approach with a Universal Type I – II – III – (123) Mixed Electrolyte
Solvent substitution for maintenance and overhaul operations of military systems has been a primary environmental concern for many years. Cadmium replacement in these systems has been targeted for decades. Both of these areas have a common obstacle for implementation of any potential alternate. Hydrogen embrittlement of high strength steel is the most predominant unforeseen hurdle since high strength materials show sensitivity to the phenomena and the source of the hydrogen can be anything within the fabrication process, maintenance practice or the natural corrosion cycle. Standardized testing on this issue has traditionally stemmed from the aerospace industry where it is a principal focus.
#research #masking #aerospace
This paper will introduce an advanced alternative to Pb and Cd-free electroless nickel processes, which is completely free of toxic heavy metal (THM) stabilizers. The process and deposit characteristics will be discussed and compared to the traditionally Pb stabilized electroless nickel.
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Plastics are replacing metals in the manufacture of many parts, and quite often there is a need for metallic coatings on the plastics and other non-conductors. This paper will describe new processes of preparing ABS plastic substrates for subsequent metallization.