Exploring the: Electrocoating Zone

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Published: 8/1/2013

Are Ionic Liquids the Future of the Surface Treatment?
This paper is focused on the application of ionic liquids related to surface modification and metal deposition.

Published: 7/25/2013

Cyanide-Free Electroplating of Cu-Sn Alloys
This paper is a peer-reviewed and edited version of a presentation delivered at NASF SUR/FIN 2012 in Las Vegas, Nev., on June 13, 2012.

Published: 10/1/2011

E-coating Simulation
Computer simulation of coating processes has made great strides in recent years. Proper design of plating racks, thickness and property distribution of plating systems and the performance of plated coatings on parts can be predicted with uncanny ac...

Published: 8/18/2011

Investigation of Tin Whisker Formation
Immersion tin and lead-free hot air solder leveling (HASL) coatings based on SnCu or SnAgCu alloys are widely used as surface finish materials for printed circuit boards (PCB). These coatings prevent the underlying copper from corrosion and preserve...