ELECTROPLATING WHITEPAPERS

Electroplating

Electrodeposition of Ni-Fe-Mo-W Alloys - Part 4

4th-6th Quarterly Report - AESF Research Project #R-117. This NASF-AESF Foundation research project report covers the fourth through sixth quarters of project work (October 2013-June 2014).
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Electroplating

Methods and Formulas to Determine Internal Deposit Stress in Applied Metallic Coatings

Internal stress exists in electroplated and chemically applied metallic coatings. This paper reviews the test procedures for measuring deposit stress and the formulas used to calculate stress values. Many formulas used require modification to obtain actual internal stress values. Errors in this regard are examined and common mistakes are explained.
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Electroplating

Electroless Nickel-plated Steel versus Stainless Steel: Case Studies

This paper highlights two case studies of manufacturers that have replaced, or done studies to replace, stainless steel with electroless nickel-plated mild steel. In both cases, cost savings could be realized while maintaining or improving product quality.
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Electroplating

Electrodeposition of Ni-Fe-Mo-W Alloys - Part 8

Eighth Quarterly Report - AESF Research Project #R-117. This NASF-AESF Foundation research project report covers the eighth quarter of project work (October-December 2014).
#surfin #nasf #plating

Electroplating

Electrodeposition of Ni-Fe-Mo-W Alloys - Part 9

Ninth Quarterly Report - AESF Research Project #R-117. This NASF-AESF Foundation research project report covers the ninth quarter of project work (January-March 2015). In this period, Graduate student Avinash Kola has continued work on the influence of deposition conditions on the properties of the Ni-W alloys.
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Electroplating

The Study of Copper Anodes in Acid and Cyanide Plating Baths

The 1956 Carl E. Huessner Gold Medal Award was given to Charles Faust and William H Safranek for Best Paper appearing in Plating or the AES Technical Proceedings in 1955, and their paper is republished here in a series on the AES/AESF/NASF Best Paper Awards. Their work involves an evaluation of anodes for copper plating at the time when OFHC anodes were first emerging in use.
#nasf #basics #plating

Electroplating

The Adhesion of Electrodeposits to Plastics

The 1966 Carl E. Huessner Gold Medal Award was given to Dr. Edward Saubestre and co-workers for Best Paper appearing in Plating in 1965, and their paper is republished here in a series on the AES/AESF/NASF Best Paper Awards. This paper is a comprehensive treatise on the Jacquet peel test, a primary test method for determining adhesion on plated plastics.
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Electroplating

Simultaneous Thickness and Electrochemical Potential Determination of Individual Layers in Multilayer Nickel Deposits

The 1981 AES Gold Medal Award was given to Ed Harbulak for the Best Paper appearing in Plating and Surface Finishing in 1980. His work involved the development of the well-known STEP test, a method for evaluating the performance of decorative Cu-Ni-Cr, measuring the electrochemical potential of nickel multilayers with a modified version of the venerable Kocour thickness tester.
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Electroplating

Application of Dynamic Impedance Measurements for Adsorbed Plating Additives

The 1986 AES Gold Medal Award was given to J.C. Farmer and H.R. (Rudy) Johnson for the Best Paper appearing in Plating and Surface Finishing in 1985. Their work presents important work on electrochemical impedance measurements, then a new technique in analyzing how plating baths and their additives work.
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Electroplating

Electrochemical Assessment of Sn-Pb Solderability

The 1991 AES Gold Medal Award was given to D.M. Tench and D.P. Anderson for the Best Paper appearing in Plating and Surface Finishing in 1990. Their work dealt with a very important concern in electronics finishing in the 1990s - testing for solderability and relating it to real world performance.
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