Investigation of Tin Whisker Formation
Immersion tin and lead-free hot air solder leveling (HASL) coatings based on SnCu or SnAgCu alloys are widely used as surface finish materials for printed circuit boards (PCB). These coatings prevent the underlying copper from corrosion and preserve its solderability during lead-free assembly processes and for a long storage life of PCBs.
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Impact of REACH Regulation on the Global Finishing Market
This paper is a peer-reviewed and edited version of a presentation delivered at NASF SUR/FIN 2012 in Las Vegas, Nev., on June 12, 2012.
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Cyanide-Free Electroplating of Cu-Sn Alloys
This paper is a peer-reviewed and edited version of a presentation delivered at NASF SUR/FIN 2012 in Las Vegas, Nev., on June 13, 2012.
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Are Ionic Liquids the Future of the Surface Treatment?
This paper is focused on the application of ionic liquids related to surface modification and metal deposition.
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