Immersion tin and lead-free hot air solder leveling (HASL) coatings based on SnCu or SnAgCu alloys are widely used as surface finish materials for printed circuit boards (PCB). These coatings prevent the underlying copper from corrosion and preserve its solderability during lead-free assembly processes and for a long storage life of PCBs.
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Innovative Applications of Electroplating and PVD for New Material Solutions - The 54th William Blum Lecture
The following is Dr. Per Møller’s William Blum Memorial Lecture at SUR/FIN 2018, in Cleveland, Ohio on June 4, 2018, with commentary by NASF Technical Editor James H. Lindsay. It covers a variety of projects involved with surface finishing applications, including sustainable energy. Due to Dr. Møller’s serious illness, he was unable to make the journey to SUR/FIN. In his stead, his longtime professional colleague, Dr. Lars Pleth Nielsen, of the Danish Technological Institute (DTI), presented the lecture.
#research #energy #surfin