Investigation of Tin Whisker Formation
Immersion tin and lead-free hot air solder leveling (HASL) coatings based on SnCu or SnAgCu alloys are widely used as surface finish materials for printed circuit boards (PCB). These coatings prevent the underlying copper from corrosion and preserve its solderability during lead-free assembly processes and for a long storage life of PCBs.
#research #electronics #pollution control
Painting Proportioners Becoming Popular With Finishers
Offer high ratio accuracy, various flow rates
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#research #pollution control
Impact of REACH Regulation on the Global Finishing Market
This paper is a peer-reviewed and edited version of a presentation delivered at NASF SUR/FIN 2012 in Las Vegas, Nev., on June 12, 2012.
#nasf #research #pollution control
Innovative Applications of Electroplating and PVD for New Material Solutions - The 54th William Blum Lecture
The following is Dr. Per Møller’s William Blum Memorial Lecture at SUR/FIN 2018, in Cleveland, Ohio on June 4, 2018, with commentary by NASF Technical Editor James H. Lindsay. It covers a variety of projects involved with surface finishing applications, including sustainable energy. Due to Dr. Møller’s serious illness, he was unable to make the journey to SUR/FIN. In his stead, his longtime professional colleague, Dr. Lars Pleth Nielsen, of the Danish Technological Institute (DTI), presented the lecture.
#research #surfin #vacuum-vapor
Biological Wastewater Treatment for Industrial Applications
With tightening limits on nutrients and Biological Oxygen Demand (BOD), is a small scale biological system right for your industrial facility?
#research #surfin